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Thermoformed Packaging 2007 has now taken place.
 
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Thermoformed packaging is one of the fastest moving packaging technologies, growing in both food and non-food applications. This conference will showcase innovations in packaging design and decoration, security and safety features, materials, efficient production, food contact legislation and much more.

Who will you meet?


See the geographical breakdown of delegates from all our previous packaging-related conferences:

This is the only event dedicated to the thermoformed packaging market – if you are a brand-owner, packaging company, machinery manufacturer, mould designer or material supplier, you should be here.

Highlights include: an extended design session, which will show techniques and examples of design used to enhance shelf-appeal; a world-first from Hekuma, who will share details of in-mould labelling technology for blister packs and clamshells; plus details of projects from leading packaging companies Autobar, Sharp Interpack and Sky Light.

Supported by

Hekuma

Supported by

Iom3


©Emap plc 2006/07. The programme may change due to unforeseen circumstances. Emap reserves the right to alter the venue and/or speakers. All use is subject to our Terms and conditions / Privacy policy
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